BARCELONA, Spain, Feb. 19, 2016 /PRNewswire/ --
Live product demonstrations and new announcements from MultiTech regarding its newest IoT technologies at Mobile World Congress, Embedded World and IBM Interconnect.
Mobile World Congress, Barcelona, February 22-25
Embedded World, Exhibition Centre, Nuremberg, February 23-25
IBM Interconnect, M2M Grand and Mandalay Bay, Las Vegas, February 21-25
The MultiConnect Conduit is the industry's most configurable, manageable, and scalable communications gateway for industrial IoT applications and is ideal for numerous market segments including, Agricultural, Industrial, Smart Cities, and Medical. Each Conduit gateway has the ability to manage thousands of MultiConnect mDot modules and other sensors and transmit their data over any cellular network to a customer's preferred data management platform. MultiConnect mDots are inexpensive radios using the new Semtech LoRa™, low power, wide area RF modulation. MultiConnect mDots bring intelligence, reduced complexity and BOM cost to the very edge of the network by running ARM's mbed OS on a low power ARM® Cortex®-M4 series processor. Limited samples of the new LTE MultiConnect Conduit gateway are now available with general availability later this year.
Users can now seamlessly communicate with sensors and assets that incorporate Microchip's PIC based LoRa modules in addition to using MultiTech's ARM® mbed™ programmable mDot LoRa modules.
By joining forces, Actility and MultiTech deliver a complete end-to-end solution to the fast growing LoRa ecosystem, opening a wide range of opportunities for innovative SmartCities and SmartBuildings applications. MultiTech macro-cell Conduit gateways are a small footprint IP67 certified enclosure simplifying roof top or cell mast installations often exposed to rain and extreme temperature. A compact and easy to install indoor version of the Conduit gateway is also available which can significantly extend network coverage in industrial facilities simply and easily without any disruption.
Introduction of the MultiConnect xDot, a secure endpoint module to communicate over LoRaWAN networks. The MultiConnect xDot joins the MultiTech family of LoRaWAN communications devices that also includes the programmable MultiConnect Conduit gateway, MultiConnect mDot modules and MultiConnect® mCard™ gateway accessory cards. This latest addition to the LoRa product line features a compact, surface-mount form factor, mbed enabled processor and very low power consumption for extended battery life.
For enhanced security, the MultiConnect xDot incorporates a hardware-based secure element that delivers dual-key AES-128 encryption for both the network connection and the application itself.
In response to customer demands for a ruggedized solution to deploy LoRaWAN technology to remote, outdoor locations, MultiTech has packaged the award winning MultiConnect Conduit gateway in an IP67 compliant enclosure in order to provide durable, low-power, wide-area connectivity in support of applications in the agriculture and energy industries, as well as others which require pre-packaged, industrial, weather-proof coverage in remote locations.
MultiTech designs, develops and manufactures communications equipment for the industrial internet of things – connecting physical assets to business processes to deliver enhanced value. Our commitment to quality and service excellence means you can count on MultiTech products and people to address your needs, while our history of innovation ensures you can stay ahead of the latest technology with a partner who will be there for the life of your solution. For more information, please visit www.multitech.com.