SAN JOSE, Calif., Feb. 14, 2017 /PRNewswire/ -- Cadence Design Systems, Inc. (NASDAQ: CDNS) will showcase its Tensilica® intellectual property (IP) at Mobile World Congress 2017, at the Fira Gran Via, Hall 6, Stand 6L36, Barcelona, Spain.
To book an appointment with Cadence® engineers or management at Mobile World Congress 2017, please use our meeting request tool.
What:
Cadence will host meetings with leading systems and semiconductor companies, and demonstrate its Tensilica DSPs for audio, vision and IoT, as well as the Microsoft HoloLens and other Tensilica-powered consumer products.
When:
Mobile World Congress 2017 takes place February 27 to March 2, 2017. The exhibit halls are open from 9:00 a.m. to 7:00 p.m. Monday through Wednesday, and 9:00 a.m. to 4:00 p.m. on Thursday.
Where:
Fira Gran Via
Hall 6, Stand 6L36
Av. Joan Carles I, 64
08908 L'Hospitalet de Llobregat
Barcelona, Spain
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at www.cadence.com.
© 2017 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo, and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.
Cadence Newsroom
408-944-7039
newsroom@cadence.com
SOURCE Cadence Design Systems, Inc.